Technologies

 

TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  •  
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  •  
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  •  
  • Fiber Laser Welding
  •  
  • Fluid Dispensing
  •  
  • Fume Extraction
  • G
  • Gap Welding
  •  
  • Green Laser Welding
  • H
  • Heat Staking
  •  
  • Heat-Sealing/ACF Final Bonding
  •  
  • Hermetic Sealing of electronic packages
  •  
  • Hot Bar Bonding
  •  
  • Hot Bar Reflow Soldering
  •  
  • Hot Bar Systems
  •  
  • Hot Crimping
  • I
  • Induction Heating
  •  
  • Inscribe
  •  
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  •  
  • Laser Marking
  •  
  • Laser Marking Systems
  •  
  • Laser Seam Welding
  •  
  • Laser Spot Welding
  •  
  • Laser Welding
  •  
  • Laser Welding Systems
  • M
  • Marking
  •  
  • Micro Joining
  •  
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  •  
  • Plastic Welding
  •  
  • Projection Welding
  • R
  • Remote Services
  •  
  • Resistance Welding
  •  
  • Resistance Welding Systems
  •  
  • Robotic Soldering
  • S
  • Saw Blade System
  •  
  • Seam Welding
  •  
  • Short Cycle Studwelding
  •  
  • Single Component Positive Displacement Dispensing
  •  
  • Single Component Time/Pressure Dispensing
  •  
  • Spot Welding
  •  
  • Strand Welding
  •  
  • Studwelding
  •  
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  •  
  • Two Component Dispensing
  • W
  • Weld Monitoring
  •  
  • Welding
  • Laser Marking

    Laser marking processLaser marking is a clean, fast, non-contact process which relies on the intense heat of a focused laser beam to permanently modify the surface of the material being marked.

    The laser mark can take many forms such as:

    • black carbonization

    • bleaching or changing the color of an additive in the material

    • physical modification of the surface finish

    • scribing a shallow groove by vaporization

    • controlled modification of the surface by melting

    • a combination of any of these processes

    The type of marking is dependent on the characteristics of the laser. High peak power enables engraving,while the wavelength determines the type of Interaction with the material. Above 700 nm the interaction is mainly thermal. At lower wavelengths such as 532nm and 355nm of frequency doubled and tripled Nd:YAG lasers cause a photochemical reaction. Miyachi solutions allow the marking of alphanumeric characters, bar-codes, 2 DID Matrix, serial numbers, logos and graphics which are applied on metals, semiconductors, plastics, ceramics and other materials. Some applications require to have highly visible and attractive marks while other applications need marks on obscure places or require marks small enough to be only visible using magnification.
     

     

    Laser Marking Benefits:

    • Most materials can be laser marked

    • High contrast marking

    • Small features

    • Flexible, fast and contactless

    • Ineradicable, corrosion resistant, scratch resistant

    • Clean environmentally friendly (no paints or additives)
       

    Laser Marking Applications
    Laser Marking can be achieved on almost all materials and is used on medical tools, PCB's, mobile phones, solar cells, semiconductors, etc.

    Our proven technologies enable the Automotive, Electronics & Solar Cells, IT & Multimedia, Medical, Aerospace and Defence industries to laser mark a variety of applications.

    Automotive Medical IT & Multimedia

    Click on the Laser Marker icon to learn more about our Laser Marking products.

    Laser Marker products

     
     
    More information