Technologies

 

TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
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  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
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  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
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  • Fiber Laser Welding
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  • Fluid Dispensing
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  • Fume Extraction
  • G
  • Gap Welding
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  • Green Laser Welding
  • H
  • Heat Staking
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  • Heat-Sealing/ACF Final Bonding
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  • Hermetic Sealing of electronic packages
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  • Hot Bar Bonding
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  • Hot Bar Reflow Soldering
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  • Hot Bar Systems
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  • Hot Crimping
  • I
  • Induction Heating
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  • Inscribe
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  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
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  • Laser Marking
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  • Laser Marking Systems
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  • Laser Seam Welding
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  • Laser Spot Welding
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  • Laser Welding
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  • Laser Welding Systems
  • M
  • Marking
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  • Micro Joining
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  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
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  • Plastic Welding
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  • Projection Welding
  • R
  • Remote Services
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  • Resistance Welding
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  • Resistance Welding Systems
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  • Robotic Soldering
  • S
  • Saw Blade System
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  • Seam Welding
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  • Short Cycle Studwelding
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  • Single Component Positive Displacement Dispensing
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  • Single Component Time/Pressure Dispensing
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  • Spot Welding
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  • Strand Welding
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  • Studwelding
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  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
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  • Two Component Dispensing
  • W
  • Weld Monitoring
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  • Welding
  • Hot Bar Bonding

    Hot Bar Bonding is a general expression for a variety of process technologies such as Hot Bar Reflow Soldering, Heat Staking, ACF Laminating/pre-Bonding and Heat-Seal/ACF Final bonding. The Hot Bar Bonding process is done using a 'thermode' or "Hot Bar" which, through a closed-loop controlled process is heated and cooled creating an electrical interconnection between the materials. The electrical resistance and design of the thermode produces the energy necessary to heat the joining area and to create the inter-connection. As the electricity flows through the thermode, the heat generated is conducted directly into the product.

    Hot bar Reflow Soldering application Heat Staking application Heat Sealing application

    Hot Bar Bonding Techniques:

    • Hot Bar Reflow Soldering is a selective soldering process where two pre-soldered parts are heated to a temperature that causes the solder to flow and re-solidify forming a permanent bond between the parts

    • ACF Laminating/pre-Bonding is a Hot bar Bonding technique for attaching PCB's to displays using a conductive adhesive and flex foils using a electrical-conductive-adhesive material. The ACF Laminating/pre-Bonding process is the first step to apply the adhesive material to the part(s)

    • Heat-Sealing/Final bonding is a Hot bar Bonding technique for final bonding attaching PCB's to displays using a conductive adhesive and flex foils using a electrical-conductive-adhesive material.

    • Heat Staking is an assembly process where two materials with at least one plastic part are moulded together through a temperature controlled process. This type of application can be processed with a piece protruding from one part that fits into the hole of the second part. The piece is then deformed by applying heat and force through the thermode forming a head which locks the two pieces together. Visit our specific page on Heat Staking to find more detailed information on the process.

    Hot Bar Bonding Applications
    Hot Bar Bonding Techniques are reproducible, quantifable, and traceable to quality standards such as ISO / NIST. Typical applications are connecting flex-foils to printed circuit boards (PCB) or LCD glass-panels, wires, coax cables and many other materials such a very light or small components.

    Our proven technologies enable the Automotive, Electronics & Solar Cells,  IT & Multimedia, Medical, Aerospace, and Defence industries to bond a variety of applications.

    Automotive Electronics & Solar Cells Aerospace

    Click on the Hot Bar icon to learn more about our Hot Bar Bonding products

    Hot bar Bonding products